Kortec looks into rigid packaging
European Plastics News staff
Posted 30 July 2009 8:18 am GMT
Kortec is broadening its multi-layer packaging horizons with co-injection moulding technology for rigid food packaging.
Intended to compete with metal, foil or thermoformed containers, the thin-wall technology includes an EVOH barrier layer and could potentially save up to 20% of resin compared to thermoforming, while also allowing greater design flexibility, said Russell Bennett, vice president sales and marketing.
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